薄夹层界面热弛豫解及其在冲击温度研究中的意义

Thermal Relaxation at Thin-Layer Interfaces: Its Significance to Shock Temperature Study

Laboratory for Shock Wave and Detonation Physics Research, Southwest Institute of Fluid Physics, Chengdu 610003, China

摘要: 对样品/薄夹层/窗口组成的三层介质双界面热传导问题进行求解。在3个不同初温、不同热物性参数及边界条件下，获得了夹层介质中的温度解，给出了界面温度历史随薄层厚度、热扩散系数和介质之间热扩散系数之比的变化规律。从理论分析和实验结果发现，当夹层厚度小于1 m，热扩散系数大于10-4 m2/s时，在实验观测的时间内，界面温度历史将很快衰减到一平台，其幅度只由样品、窗口的初温和热扩散系数确定，而与夹层介质的初温、热传导系数无关。
- 冲击温度测量 /
- 界面温度 /
- 热驰豫
Abstract: The thermal conduction problem of two interfaces for a sample/thin-layer/window configuration is solved for different initial temperature distribution, material thermal properties and different boundary conditions. Results reveal that the interface temperature history decreases sharply at first then approaches to a plateau within the observational time if the thickness of the thin-layer is very small (less than 1 mm) and the thermal diffusion coefficient is very large (greater than 10-4 m2/s). The amplitude of the temperature plateau depends on the initial temperature and the thermal diffusion coefficients of the sample or the window, does not relate to those of the thin-layer.
- shock temperature measurement /
- interface temperature /
- thermal relaxation