Volume 26 Issue 2
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LIU Fang, LIU Yong-Gang, XIE Hong-Sen. Numerical Simulation of Temperature Field in Sample Assembly of Cubic Press[J]. Chinese Journal of High Pressure Physics, 2012, 26(2): 135-140. doi: 10.11858/gywlxb.2012.02.003
Citation: LIU Fang, LIU Yong-Gang, XIE Hong-Sen. Numerical Simulation of Temperature Field in Sample Assembly of Cubic Press[J]. Chinese Journal of High Pressure Physics, 2012, 26(2): 135-140. doi: 10.11858/gywlxb.2012.02.003

Numerical Simulation of Temperature Field in Sample Assembly of Cubic Press

doi: 10.11858/gywlxb.2012.02.003
  • Received Date: 13 Sep 2010
  • Rev Recd Date: 13 Dec 2010
  • Issue Publish Date: 15 Apr 2012
  • Numerical simulation for the temperature distribution in sample assembly of cubic press was carried out by using the finite-element method with simplified model and boundary conditions. Based on the adjustment of parameters of the models in simulation, the temperature distribution induced by pressure transmission media, shapes of heater and conductive metal ring were discussed in details. The results indicate that the use of zirconia instead of pyrophyllite as the buffer and thermal insulator can elevate the temperature and at the same time lower the thermal gradient in sample area while reducing power consumption. Different shapes of heater will affect on the temperature distribution. In the case of the metal ring being used in assembly, properly increasing the thickness of the ring will be beneficial to obtain desirable temperature distribution. This work could be a useful reference to optimize the design of sample assembly in cubic press for high temperature and high pressure experiments.

     

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