金刚石膜的厚度及背表面过渡层对热导率的影响

顾长志; 金曾孙; 吕宪义; 邹广田; 张纪法; 方容川

doi:10.11858/gywlxb.1997.01.011

金刚石膜的厚度及背表面过渡层对热导率的影响

doi: 10.11858/gywlxb.1997.01.011

1.
吉林大学超硬材料国家重点实验室，吉林长春 130023；
2.
中国科技大学物理系，安徽合肥 230026

详细信息

通讯作者:
顾长志

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出版历程
- 收稿日期: 1996-09-06
- 修回日期: 1996-10-21
- 刊出日期: 1997-03-05

The Effects of Thickness and Back Surface of Diamond Film on Thermal Conductivity

1.
State Key Laboratory for Superhard Materials, Jilin University, Changchun 130023, China;
2.
Physics Department, Science and Technology University of China, Hefei 230026, China

More Information

Corresponding author: GU Chang-Zhi

摘要

摘要: 采用微波等离子体化学气相沉积（MWPCVD）方法制备金刚石膜，研究了金刚石膜的厚度以及生长初期的SiC过渡层对其热导率的影响，给出了膜厚和背表面SiC过渡层减薄厚度与金刚石膜热导率的关系。
- 金刚石膜 /
- 热导率 /
- 膜厚 /
- 背表面过渡层
Abstract: In this paper, we described the effects of the thickness and back surface of diamond film on thermal conductivity. Diamond films with different thicknesses were synthesized by MWPCVD method. The results show that high thermal conductivity diamond film can be acquired with thickened film and removed back surface (SiC).
- diamond film /
- thermal conductivity /
- thickness /
- back surface

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参考文献(8)

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