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Chinese Journal of High Pressure Physics  > 2012  >  26(3): 306-312.
ZHANG Wen-Kai, PENG Fang, GUO Zhen-Tang, GUAN Jun-Wei, LI Rong-Qi. Research on Thermal Conductivity of Diamond with Cr, Ti Coating/Copper Composite Materials by Sintering under High Pressure[J]. Chinese Journal of High Pressure Physics, 2012, 26(3): 306-312. doi: 10.11858/gywlxb.2012.03.010
Citation: ZHANG Wen-Kai, PENG Fang, GUO Zhen-Tang, GUAN Jun-Wei, LI Rong-Qi. Research on Thermal Conductivity of Diamond with Cr, Ti Coating/Copper Composite Materials by Sintering under High Pressure[J]. Chinese Journal of High Pressure Physics, 2012, 26(3): 306-312. doi: 10.11858/gywlxb.2012.03.010
shu

Research on Thermal Conductivity of Diamond with Cr, Ti Coating/Copper Composite Materials by Sintering under High Pressure

doi: 10.11858/gywlxb.2012.03.010

  • Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China

  • Received Date: 06 May 2011
  • Rev Recd Date: 02 Jul 2011
  • Publish Date: 15 Jun 2012
    Abstract
  • Cr or Ti is coated on diamond surface by magnetron sputtering, and diamond with active metal coating/copper composite materials is sintered under high temperature and high pressure. The experimental results show that the introduction of active metals enhances the bond strength between diamond and copper, reduces the thermal boundary resistance and improves the thermal conductivity of diamond/copper composite materials. In addition, the experiments indicate that the thermal conductivity of the composites decreases with increasing diamond content and the reducing grain size of diamond. This phenomenon is attributed to the thermal boundary-resistance. The thermal conductivity of diamond/copper composite materials can be increased by increasing the grain size of diamond and improving the interface of diamond and copper.

     

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    • References(25)
  • Liu C Z, Wang Z F, Jiang G S. Advances in metal-matrix material for electronic packaging [J]. Ordnance Material Science and Engineering, 2001, 24(2): 49-53．(in Chinese)
    刘春正, 王志法, 姜国圣. 金属基电子封装材料进展 [J]. 兵器材料科学与工程, 2001, 24(2): 49-53．
    Yang B C. Research advances in material for electronic packaging [J]. Function Materials Information, 2006, 5(3): 9-13. (in Chinese)
    杨邦朝. 电子封装材料的研究进展 [J]. 功能材料与信息, 2006, 5(3): 9-13. (in Chinese)
    Wang T J, Zhou W P, Xiong N, et al. PM materials for electronic packaging [J]. Powder Metallurgy Technology, 2005, 23(2): 145-150. (in Chinese)
    王铁军, 周武平, 熊宁, 等. 电子封装用粉末冶金材料 [J]. 粉末冶金技术, 2005, 23(2): 145-150.
    Zheng X H, Hu M, Zhou G Z. Status and prospects of new materials for electric packing [J]. Journal of Jiamusi University(Natural Science Edition), 2005, 23(3): 460-464. (in Chinese)
    郑小红, 胡明, 周国柱. 新型电子封装材料的研究现状及展望 [J]. 佳木斯大学学报(自然科学版), 2005, 23(3): 460-464.
    Tong Z S, Shen Z S. Status and development of materials for metal packaging [J]. Electronics ＆ Packaging, 2005, 5(3): 6-14. (in Chinese)
    童震松, 沈卓身. 金属封装材料的现状及发展 [J]. 电子与封装, 2005, 5(3): 6-14.
    Luo X, Yang Y Q, Wang H Y, et al. Research progress on the copper matrix composites [J]. Materials Science, 2006, 20(8): 76-78. (in Chinese)
    罗贤, 杨延清, 王含英, 等. 铜基复合材料的研究现状 [J]. 材料导报, 2006, 20(8): 76-78.
    Yoshida K, Morigami H. Thermal properties of diamond/copper composite material [J]. Microelectron Reliab, 2004, 44: 303-308.
    Schubert Th, Trindade B. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications [J]. Mater Sci Eng A, 2008, 475: 39-44.
    Weber L, Tavangar R. On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X(X= Cr, B) diamond composites [J]. Scripta Mater, 2007, 57: 988-991.
    Chu K, Liu Z F, Jia C C. Thermal conductivity of SPS consolidated Cu/Diamond composites with Cr-coated diamond particles [J], J Alloy Compd, 2010, 490 , 453-458.
    Ma S Y, Wang E Z, Lu W Y, et al. Study on thermal conductivity of diamond/copper composite [J]. Material ＆ Heat Treatment, 2008, 37(4): 36-38. (in Chinese)
    马双彦, 王恩泽, 鲁伟员. 金刚石/铜复合材料热导率研究 [J]. 热加工工艺, 2008, 37(4): 36-38.
    Wang Y H, Wang M Z, Zhang X Y. Study on Cr coating on diamond by magnetron sputtering [J]. Thin Film Science and Technology, 1992, 5(4): 29-34. (in Chinese)
    王艳辉, 王明智, 张湘仪. 金刚石表面磁控溅射镀Cr的研究 [J]. 薄膜科学与技术, 1992, 5(4): 29-34.
    Lin Z D. Metal and diamond bonding technology and its application [J]. Physics, 1990, 19(7): 420-421. (in Chinese)
    林增栋. 金属与金刚石粘结技术及其应用 [J]. 物理, 1990, 19(7): 420-421.
    Progelhof R C, Throne J L, Ruetsch R R. Methodes for predicting the thermal conductivity of composite systems [J]. Polymer Eng Sci, 1986, 16(9): 615-616.
    Davis L C, Artz B E. Thermal conductivity of metal matrix composites [J]. J Appl Phys, 1995, 77(10): 4954-4960.
    Stoner R J , Maris H J. Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K [J]. Phys Rev B, 1993, 48(22): 16373-16387.
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