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Chinese Journal of High Pressure Physics  > 2007  >  21(1): 20-28 .
ZHANG Peng, ZHAO Feng, BAI Shu-Lin, FU Bin, ZHANG Guo-Hua. Experimental Study on the Microstructures and Dynamic Behavior of a PBX Substitute Material[J]. Chinese Journal of High Pressure Physics, 2007, 21(1): 20-28 . doi: 10.11858/gywlxb.2007.01.004
Citation: ZHANG Peng, ZHAO Feng, BAI Shu-Lin, FU Bin, ZHANG Guo-Hua. Experimental Study on the Microstructures and Dynamic Behavior of a PBX Substitute Material[J]. Chinese Journal of High Pressure Physics, 2007, 21(1): 20-28 . doi: 10.11858/gywlxb.2007.01.004
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Experimental Study on the Microstructures and Dynamic Behavior of a PBX Substitute Material

doi: 10.11858/gywlxb.2007.01.004
  • 1.

    Center for Advanced Composite Materials, Departtment of Mechanics and Aerospace Technology, College of Engineering, Peking University, Beijing 100871, China;

  • 2.

    Laboratory for Shock Wave and Detonation Physics Research, Institute of Fluid Physics, CAEP, Mianyang 621900, China

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  • Corresponding author: BAI Shu-Lin
  • Received Date: 08 Nov 2005
  • Rev Recd Date: 18 Jan 2006
  • Publish Date: 05 Mar 2007
    Abstract
  • The microstructures and intrinsic defects engendered during the compression process of manufacture of a PBX substitute material D-90031, as well its dynamic behavior and failure mechanisms were studied. By using digital image treatment technique, in situ nano-indenter system, Split Hopkinson Pressure Bar (SHPB) and weight dropping tests, we obtained the features of microstructures, modulus and hardness of each constituent, dynamic properties, as well as the size distribution of pieces and failure modes. It was found that the grain shape changed with the applied compressive load, such as the grain was elongated along the direction vertical to the load application direction. The size distribution of pieces after impact meets a certain statistical rule. The results obtained are meaningful to deeply understand the relationship between the properties and microstructures of solid explosive.

     

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