Thermal Relaxation at Thin-Layer Interfaces: Its Significance to Shock Temperature Study

The thermal conduction problem of two interfaces for a sample/thin-layer/window configuration is solved for different initial temperature distribution, material thermal properties and different boundary conditions. Results reveal that the interface temperature history decreases sharply at first then approaches to a plateau within the observational time if the thickness of the thin-layer is very small (less than 1 mm) and the thermal diffusion coefficient is very large (greater than 10-4 m2/s). The amplitude of the temperature plateau depends on the initial temperature and the thermal diffusion coefficients of the sample or the window, does not relate to those of the thin-layer.