贴片晶振在冲击环境下的损伤边界

罗凯文 LI Q. M.

罗凯文, LI Q. M.. 贴片晶振在冲击环境下的损伤边界[J]. 高压物理学报, 2021, 35(1): 015301. doi: 10.11858/gywlxb.20200572
引用本文: 罗凯文, LI Q. M.. 贴片晶振在冲击环境下的损伤边界[J]. 高压物理学报, 2021, 35(1): 015301. doi: 10.11858/gywlxb.20200572
LUO Kaiwen, LI Q. M.. Damage Boundary of Crystal Oscillator under Shock Environment[J]. Chinese Journal of High Pressure Physics, 2021, 35(1): 015301. doi: 10.11858/gywlxb.20200572
Citation: LUO Kaiwen, LI Q. M.. Damage Boundary of Crystal Oscillator under Shock Environment[J]. Chinese Journal of High Pressure Physics, 2021, 35(1): 015301. doi: 10.11858/gywlxb.20200572

贴片晶振在冲击环境下的损伤边界

doi: 10.11858/gywlxb.20200572
详细信息
    作者简介:

    罗凯文(1994-),男,硕士研究生,主要从事冲击环境研究. E-mail:luokw67@gmail.com

    通讯作者:

    Li Q.M.(1962-),男,博士,教授,博士生导师,主要从事冲击动力学研究. E-mail:Qingming.li@manchester.ac.uk

  • 中图分类号: O347; TB123

Damage Boundary of Crystal Oscillator under Shock Environment

  • 摘要: 贴片式石英晶体振荡器广泛应用于各类电子和通信设备系统中。针对晶振在冲击环境中容易出现结构破坏而导致系统工作异常的问题,通过分析单自由度系统在不同频率冲击载荷作用下的响应特点,建立了结构的应力响应水平与相关冲击响应谱谱值之间的联系,获得了较已有结论更合理的损伤边界形式。根据典型晶振结构易损组件的力学特性建立对应的简化分析模型,得到了贴片晶振在大频率范围内的结构损伤边界。利用有限元仿真软件,对晶振结构在0.5~30 kHz频率范围内冲击载荷下的响应进行仿真分析,验证了该损伤边界的有效性。这也为以贴片晶振为代表的微小元器件在冲击环境下的可靠性研究提供了一种可行的方法。

     

  • 图  贴片晶振的结构

    Figure  1.  Structure of surface mounted device (SMD) crystal oscillator

    图  晶振在冲击下的断裂部位[4]

    Figure  2.  Fracture position of crystal under impact loading[4]

    图  单自由度质量弹簧系统

    Figure  3.  Single-degree-of-freedom system with mass, stiffness system

    图  相对时间尺度与结构冲击响应的分析方法[18]

    Figure  4.  Relative time scale and the analysis method of structural impact response[18]

    图  晶振结构的有限元模型

    Figure  5.  Finite element model of SMD crystal oscillator

    图  晶片组件第1、3、5阶模态距固支边相同距离的点的平均横向位移相对幅值

    Figure  6.  Average relative deflection of the points at the same distance from the fixed edge of the 1st, 3rd, and 5th order modes of the structure

    图  悬臂梁结构受均布载荷作用

    Figure  7.  Cantilever beam structure under uniform load

    图  在晶振焊盘处施加加速度载荷

    Figure  8.  Applying acceleration load to the welding pads

    图  正弦衰减信号

    Figure  9.  Attenuated sinusoidal signal

    图  10  损伤边界与临界正弦衰减信号的冲击谱

    Figure  10.  Damage boundary and SRS of critical attenuated sinusoidal signal

    图  11  晶振受横向冲击时的应力云图

    Figure  11.  Stress contour of crystal oscillator under lateral shock

    图  12  实测冲击信号

    Figure  12.  Measured shock signal

    图  13  损伤边界临界冲击信号的冲击谱

    Figure  13.  Damage boundary and shock response spectrum of critical shock signal

    表  1  模型尺寸

    Table  1.   Geometrical dimensions of the model

    Structure moduleLength/mmWidth/mmHeight/mmStructure moduleLength/mmWidth/mmHeight/mm
    Crystal plate5.03.20.08Pad1.41.10.05
    Conductive adhesive0.40.40.20Lid6.04.00.10
    Electrode2.01.50.02Circuit block 14.02.20.30
    Packaging base7.05.01.80Circuit block 20.31.20.50
    下载: 导出CSV

    表  2  有限元模型中的材料参数

    Table  2.   Material parameters in finite element model

    ModuleMaterialElastic modulus/GPaDensity/(g·cm−3)Poisson’s ratioTensile strength/MPa
    Crystal plateQuartz[Cpq][21]2.6540
    Integrated circuitSilicon13.02.330.28
    ElectrodeSilver73.210.530.38
    Packaging basePhenolic resin2.0–2.91.25–1.300.35–0.38
    LidPackfong100.88.700.37
    Conductive adhesiveEpoxy polymer2.92.520.34
    PadSnAgCu solder41.68.740.40
    下载: 导出CSV

    表  3  晶片的各阶模态频率

    Table  3.   Modal frequencies of the crystal plate

    Modal
    order
    Natural
    frequency/kHz
    Effective mass in
    normal direction/kg
    PModal
    order
    Natural
    frequency/kHz
    Effective mass in
    normal direction/kg
    P
    12.5853.26288 × 10−61.00000973.4381.13510 × 10−80.00348
    212.4797.97027 × 10−90.002441089.0444.91526 × 10−80.01506
    316.8988.92118 × 10−70.2734111106.3863.74328 × 10−90.00115
    436.7811.54332 × 10−80.0047312114.3361.38521 × 10−100.00004
    542.5463.24468 × 10−70.0994413120.2112.83863 × 10−90.00087
    656.5974.45802 × 10−110.0000114127.1392.82303 × 10−80.00865
    761.5525.64709 × 10−90.0017315145.9522.23781 × 10−100.00007
    869.9821.17592 × 10−70.03604
    下载: 导出CSV
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出版历程
  • 收稿日期:  2020-06-19
  • 修回日期:  2020-07-07
  • 发布日期:  2020-10-25

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