高压烧结镀Cr、Ti膜金刚石/铜复合材料热导率研究

张文凯; 彭放; 郭振堂; 管俊伟; 李荣祺

doi:10.11858/gywlxb.2012.03.010

高压烧结镀Cr、Ti膜金刚石/铜复合材料热导率研究

doi: 10.11858/gywlxb.2012.03.010

四川大学原子与分子物理研究所，四川成都 610065

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通讯作者:
彭放 pengfang8888@yahoo.com.cn

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出版历程
- 收稿日期: 2011-05-06
- 修回日期: 2011-07-02
- 发布日期: 2012-06-15

Research on Thermal Conductivity of Diamond with Cr, Ti Coating/Copper Composite Materials by Sintering under High Pressure

Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, China

摘要

摘要: 采用磁控溅射方法，在金刚石表面镀覆活性金属Cr膜和Ti膜，在高温高压下合成了镀活性金属膜金刚石/铜复合材料。实验发现，活性金属的加入增强了金刚石与铜界面间的结合强度，减少了界面热阻，提高了复合材料的热导率。复合材料热导率随着金刚石体积分数的增加而降低，随着金刚石的粒度增大而提高。这主要是由界面热阻引起的，可以通过增大金刚石粒度和改善界面状态来提高复合材料热导率。
- 磁控溅射 /
- 高温高压 /
- 热导率 /
- 界面热阻
Abstract: Cr or Ti is coated on diamond surface by magnetron sputtering, and diamond with active metal coating/copper composite materials is sintered under high temperature and high pressure. The experimental results show that the introduction of active metals enhances the bond strength between diamond and copper, reduces the thermal boundary resistance and improves the thermal conductivity of diamond/copper composite materials. In addition, the experiments indicate that the thermal conductivity of the composites decreases with increasing diamond content and the reducing grain size of diamond. This phenomenon is attributed to the thermal boundary-resistance. The thermal conductivity of diamond/copper composite materials can be increased by increasing the grain size of diamond and improving the interface of diamond and copper.
- magnetron sputtering /
- high temperature and high pressure /
- thermal conductivity /
- thermal boundary-resistance

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